Key Points
- Thermal glue and thermal paste are both thermally conductive materials, but their compositions and purposes differ.
- Thermal glue is used for permanent bonding, while thermal paste is used for temporary heat conduction between surfaces.
- Thermal glue is adhesive and suitable for diverse materials, while thermal paste is non-adhesive and primarily for metal-to-metal contact.
- Thermal glue provides a long-lasting bond, while thermal paste may need re-application over time.
- Thermal glue is more challenging to remove, while thermal paste is easy to replace during maintenance.
Thermal products play a crucial role in ensuring optimal temperatures within computer components, particularly in high-performance setups. The two major players in this space are thermal glue and thermal paste. While they might sound like they serve the same function, their applications and characteristics can differ significantly. If you’re unsure about which one to opt for, or are simply curious about the differences, you’re in the right place.
Thermal Glue vs. Thermal Paste: Side-by-Side Comparison
| Aspect | Thermal Glue | Thermal Paste |
|---|---|---|
| Primary Purpose | Permanent bonding & heat conduction | Temporary heat conduction between surfaces |
| Application | Chipsets, heat sinks that need permanent attachment | CPUs, GPUs with heat sinks |
| Composition | Epoxy-based with metallic or ceramic particles | Grease-based with metal or ceramic particles |
| Durability | Permanent (hard to remove) | Semi-permanent (can be reapplied) |
| Conductivity | Moderate to high | High |
| Curing Time | Varies but usually a few hours to days | None or very little |
| Cost | Slightly higher than thermal paste | Generally cheaper and widely available |
- Lower thermal resistance than the MX-4
- For CPUs, GPUs, and Consoles
- Neither electrically conductive nor capacitive
- Also works in direct-die cooling for graphics cards or console processors
Thermal Glue vs. Thermal Paste: What’s the Difference?
Below, we will compare thermal glue and thermal paste within various categories.
Composition and Physical Properties
Both thermal glue and thermal paste are thermally conductive materials, but their compositions differ due to their distinct purposes.
Typically, thermal glue is a mixture of epoxy resins and metallic filling agents, such as silver, aluminum, or zinc. The metallic fillers grant it the high thermal conductivity required, while the epoxy provides the adhesive quality.
Thermal paste is a mixture of a non-adhesive compound and thermally conductive materials, often metal oxides, zinc, or micro silver particles. The consistency is usually like toothpaste, ensuring that it spreads easily over surfaces.
Primary Purpose and Application
©Mr AVP/Shutterstock.com
The way they are used and the primary purpose of each compound are among their most defining characteristics.
Thermal glue is used for permanently attaching components. Once applied and cured, thermal glue provides a robust bond, ensuring the parts do not come apart. This makes it suitable for tasks where mechanical fixtures, like screws, are not appropriate or feasible.
Thermal paste’s primary purpose is to fill in microscopic air gaps between two surfaces, such as a CPU and a heatsink. By filling these gaps, the paste ensures that heat transfers more effectively between the surfaces. The compound is not adhesive, so components can be separated and reassembled without damage.
Compatibility and Versatility
The compatibility of these compounds with various materials and surfaces can influence their application.
Due to thermal glue’s adhesive nature, it can bond diverse materials beyond just metals, including plastics and ceramics. However, its robust bonding means it’s not always suitable for delicate components that might need future adjustments.
Thermal paste is primarily for metal-to-metal contact. Its application can hit limits when dealing with non-metallic surfaces. However, its non-adhesive nature makes it versatile for temporary setups or devices that might require recalibrations.
Duration and Longevity
These compounds vary significantly in terms of their durability and the time they last when applied.
Given thermal glue’s adhesive properties, it’s for long-term bonding. It will not degrade quickly and ensures that components remain affixed for an extended period. In many applications, the bond will last for the lifetime of the device.
Over time, thermal paste can dry out, harden, or degrade, which may reduce its effectiveness. Consequently, it might need re-application, especially in devices that undergo significant thermal cycles.
Ease of Removal and Maintenance
Maintenance practices and ease of removal for these compounds also diverge considerably.
Removing components bonded with thermal glue can be challenging. Doing so might require the application of heat or specific solvents, and even then, there’s a risk of damaging the components. This permanent nature makes device repairs or upgrades more complex if components need regular replacing.
Since thermal paste is non-adhesive, removing or replacing thermal paste is straightforward. During maintenance or upgrades, one can easily wipe off the old paste and apply a fresh layer. This characteristic makes thermal paste preferable for applications where periodic maintenance is typical, like personal computers.
Thermal Conductivity and Performance
While both can facilitate heat transfer, their efficiency can differ.
The thermal glue’s adhesive nature might compromise its thermal conductivity slightly when compared to high-quality thermal pastes. However, for many applications, the difference is negligible, especially when the priority is bonding.
Premium thermal pastes can offer superior thermal conductivity, ensuring heat transfers rapidly and efficiently between components. This is crucial in applications like high-performance computing, where even a slight temperature increase can impact performance.
©Nor Gal/Shutterstock.com
Cost and Availability
The market availability and cost of these compounds can vary based on their composition and the brand.
Generally, thermal glue tends to be more expensive than basic thermal pastes due to its dual function of adhesion and thermal conductivity. The price might escalate further for glues with higher conductivity materials, like silver.
A wide variety of thermal pastes are available in the market, ranging from budget-friendly options to premium ones. The price often correlates with the quality and thermal conductivity offered.
Environmental and Health Considerations
It’s essential to factor in environmental and health concerns when dealing with these compounds.
Given thermal glue’s more complex chemical composition, there’s a potential risk associated with inhaling fumes during the curing process or if it’s accidentally ingested. Moreover, the production of certain adhesive compounds may have environmental implications, requiring responsible disposal methods. Always follow safety guidelines and ensure adequate ventilation when working with thermal glues.
While thermal paste is generally considered safe for typical use, some thermal pastes might contain chemicals that can be harmful if ingested, inhaled, or in prolonged contact with the skin. Additionally, the extraction of certain metals used in thermal pastes, like silver, can have environmental ramifications. It’s always advisable to handle with care, keeping out of reach of children, and to dispose of used paste responsibly.
- Size: 10g
- Not electrically conductive
- Made to bond heat sinks to the other internal components
- Features thermal impudence of less than 0.06
Thermal Glue vs. Thermal Paste: 5 Must-Know Facts
- Thermal glue is a more permanent solution for long-term attachment.
- Thermal paste, while temporary, offers superior heat conduction between surfaces.
- Using the wrong product can lead to complications – such as permanent attachment when you only want heat conduction.
- Over time, some thermal pastes might dry out and require reapplication.
- Thermal glues generally have a curing time post-application, during which the bond strengthens.
Thermal Glue vs. Thermal Paste: Which One Is Better? Which One Should You Use?
Choosing between thermal glue and thermal paste boils down to the nature of the task at hand. If you’re aiming for a temporary setup where components might need replacing or cleaning – like most CPU-GPU setups – thermal paste is your go-to. On the other hand, if you’re seeking a permanent bond, particularly in scenarios where the components won’t require replacements or modifications, thermal glue is more appropriate. Both substances are designed with specific applications in mind.
Furthermore, considering the long-term requirements and potential maintenance needs of your system is crucial. Using the wrong product could lead to performance issues, damage, or the inconvenience of starting your project afresh. Always ensure you’re using the right product for the proper purpose to avoid regrets later on.
- $8.17Buy on Amazon
- Lower thermal resistance than the MX-4
- For CPUs, GPUs, and Consoles
- Neither electrically conductive nor capacitive
- Also works in direct-die cooling for graphics cards or console processors
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11/29/2023 10:11 am GMT - $7.99 ($22.83 / Ounce)Buy on Amazon
- Size: 10g
- Not electrically conductive
- Made to bond heat sinks to the other internal components
- Features thermal impudence of less than 0.06
We earn a commission if you make a purchase, at no additional cost to you.
11/29/2023 10:11 am GMT
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